LS400 SUPERNOVA Entech HVLP

$818.00

LS400 SUPERNOVA Entech HVLP

  • HVLP Technology – 10 PSI at the nozzle
  • Concentrated coarse atomization
  • Excellent for solvent or waterborne base coat application
  • Large fan pattern
  • Superior transfer efficiency

FEATURES

  • Patented LV Technology with split nozzle for increased material savings
  • HVLP Technology - with low operating air pressure
  • Excellent for solvent or waterborne base coat and clear coat application
  • Large fan pattern
  • Superior transfer efficiency
  • Quality surface for easy cleaning
  • Compatible with the 3M PPS cup system (adapter #43)

Flyer
Parts / Specifications